Ceramic Substrates--cs ceramic
Al2O3 ( Alumina substrate ) , AlN ( Aluminum Nitride substrate ) and ZrO2 (Zirconia substrate ) . These ceramic substrate have good mechanical strength and abrasion resistance, high thermal conductivity , very stable in high temperature and corrosive chemical and excellent electrical insulation .
1. Alumina ( Al2O3 substrate ) |
Al2O3 substrate is the most popular ceramic substrate, with excellent heat resistance, high mechnical strength , abrasion resistance and small dielectric loss .The surface of alumina substrate is quite smooth and low porosity , 99.6% alumina substrate is suitable for thin film device , 96% alumina substrate is suitable for thick film device application .
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2. Aluminium Nitride ( AlN substrate ) |
Aluminium Nitride has higher thermal conductivity , compared to alumina substrate It is about 7 to 8 times high . AlN substrate is an excellent electronic package material .
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3. Zirconia ( ZrO2 substrate ) |
Compared to alumina substrate , ZrO2 substrate has higher mechanical strength and fracture toughness it's about three times higher for bending strength, two times for fracture toughness than alumina substrate . ZrO2 ( zirconia ) also provides good abrasion resistance. It features a thermal expansion rate close to metals .
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Ceramic Substrates Porperties |
Materials |
Al2O3 |
AlN |
ZrO2 |
96% |
99.6% |
Color |
White |
White |
Gray |
White |
Density (g/cm 3 ) |
3.72 |
3.85 |
3.3 |
6.04 |
Thermal conductivity (W/m. K) |
22.3 |
29.5 |
160 -190 |
2.4 |
Thermal Expansion (x10 -6 / o C) |
8.0 |
8.2 |
4.6 |
10 |
Dielectric strength |
14E6 |
18E6 |
14E6 |
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Dielectric Constant (at 1MHZ) |
9.5 |
9.8 |
8.7 |
29 |
Loss Tangent (x10 -4 @1MHZ) |
3 |
2 |
5 |
1E-3 |
Volume Resistivity (ohm-m) |
>10 14 |
>10 14 |
>10 14 |
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Flexural Strength (N/mm 2 ) |
350 |
500 |
450 |
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